The tray has a 45-degree chamfer to provide a visual indicator of the Pin 1 orientation of the IC and prevent the stack of errors, reduce the possibility of workers making mistakes, and maximize the protection of the chip.
Providing a variety of packaging IC design solutions based on your chip, the 100% custom tray is not only suitable for storing ICs but also better protects the chip storage. We have designed a lot of packaging ways, which also include common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and SiP, etc. We can provide custom service for all packaging methods of the chip tray.
Advantage:
1. Have exported for more than 12 years.
2. Have a professional engineer and efficient management
3. Delivery time is short, normally in stock.
4. A small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to the USA, Germany, the UK, Europe, Korea, Japan, etc.
7. The factory has an ISO certificate. The Product complies with the RoHS standard.
Application:
Electronic component, Semiconductor Embedded System, Display technology, Micro and Nano systems Sensor, Test and Measurement Technology, Electromechanical equipment and systems, Power supply.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*7.62mm |
| Model | HN1809 | Cavity Size | 19.0*6.0*2.2 mm |
| Package Type | IC | Matrix QTY | 11*12=132PCS |
| Material | PPE | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Reference to the temperature resistance of different materials:
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature, and other special requirements can be customized |
FAQ
Q1: Are you a manufacturer?
A: Yes, we are a 100% manufacturer specialized in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
Q2: What information should we supply if we want a quotation?
A: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
A: Normally, 3 days. If customized, open a new mold 25~30 days around.
Q4: How about batch order production?
A: Normally, 5- 8 days or so.
Q5: Do you inspect the finished products?
A: Yes, we will do an inspection according to the ISO 9001 standard and be ruled by our QC staff.
